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(773) 277-1600 | Excellent resistance to aggressive chemicals and environments
Consistent, repeatable results for mission-critical components
Trusted by leading semiconductor equipment manufacturers
The semiconductor industry has some of the most demanding surface finish requirements of any industry that uses our services. Due to the corrosive nature of the liquids and gases used in the manufacturing processes, the industry has developed rigid specifications for acceptable finish quality.
Able's processes meet these specifications, including SEMI F19, which defines the wetted surface characterization requirements and finish acceptance criteria for electropolished 316L stainless steel components.
One of our customers sends a family of custom 316L SS fittings used in the chemical distribution systems of semiconductor manufacturing facilities. The wetted surfaces require a 10 Ra microinch finish, or better, after electropolishing. The chromium to iron ratio must be a minimum of 1.5:1 and a chromium oxide enrichment of a minimum chromium oxide to iron oxide ratio of 2:1. Results are verified through optical examination, ESCA, Auger and SEM analyses.
Compared to passivation alone, electropolishing is 30 times more effective for improving corrosion resistance. Send your samples for electropolishing and evaluation of both finish and dimensional changes.
Electropolishing delivers measurable, verifiable improvements to every metal surface — critical in an industry where a single contaminated part can destroy an entire wafer batch.
Machining leaves microscopic burrs that shed particles in cleanroom environments. Electropolishing removes them completely — eliminating a primary source of wafer contamination that passivation alone cannot address.
Compared to passivation alone, electropolishing is 30 times more effective at improving corrosion resistance — creating a uniform passive oxide layer that withstands aggressive acids, solvents, and etchants.
Electropolished surfaces achieve Ra values as low as 4 µin — far below standard machined finishes. Reduced surface area means fewer particle adhesion sites and dramatically improved cleanability between process runs.
Electropolishing enriches the surface chromium-to-iron ratio — meeting SEMI F19's minimum 1.5:1 Cr:Fe requirement and chromium oxide to iron oxide ratio of 2:1, verified through ESCA, Auger, and SEM analyses.
Our electropolished surfaces meet Class 100 cleanroom requirements. Smooth, passive surfaces reduce outgassing and minimize particle generation — essential for sub-nanometer process nodes.
Electropolishing removes only microns of material uniformly across all surfaces. If planned during design, material removal can be factored into final size specifications — preserving tight tolerances while dramatically improving surface quality.
Semiconductor fab components operate in some of the most extreme chemical and physical environments on earth. Understanding that environment is why our customers specify electropolishing as the final step.
HF, HCl, H₂SO₄, HNO₃, NaOH, and mixed acid baths at elevated temperatures and concentrations that attack unfinished metal surfaces.
Rapid thermal processing to 1000°C+, cryogenic cooling cycles, and constant thermal shock in CVD, ALD, and diffusion furnace environments.
High-energy plasma in etch and deposition tools bombards chamber surfaces — rough, unpolished surfaces shed particles directly onto wafers.
At sub-10nm process nodes, a single metallic particle or surface contaminant can destroy an entire wafer batch worth hundreds of thousands of dollars.
Wetted surface characterization requirements and finish acceptance criteria for electropolished 316L SS components.
Wetted surfaces in chemical distribution systems require 10 Ra microinch finish or better — consistently achieved by Able's process.
Results verified through optical examination, ESCA, Auger, and SEM analyses — the same methods your customers require.
Learn why enhanced corrosion resistance is one of the most common reasons engineers across a variety of industries rely on electropolishing to finish their critical metal parts, especially for parts made of stainless steel. Three included case studies show the difference electropolishing makes.
Electropolishing, with its ability to remove a microscopically precise layer of surface material with consistent results, is the finishing process of choice for such parts, for many reasons. Learn why electropolishing is more effective than other methods for removing burrs.
Whether you are an original equipment manufacturer (OEM), a part manufacturer or a metal working shop looking to solve these common surface problems, it's critical to find a solution to adequately address these issues in a cost-effective method.
Drag the slider to simulate stock removal and see how surface properties change in real time, including simulated SEM cross-section imagery.
See below for the exact expected finish from Able's process guide, typical semiconductor components, and Ra improvement for every alloy.
| Alloy | Category | Expected Finish | Typical Semiconductor Parts | Process Environment | Electropolishing Benefit | Ra Before → After |
|---|
SEMI F19 defines the wetted surface characterization requirements and finish acceptance criteria for electropolished 316L stainless steel components used in semiconductor manufacturing. Able Electropolishing's processes meet SEMI F19 in full — achieving Ra 10 µin or better, a minimum Cr:Fe ratio of 1.5:1, and a chromium oxide to iron oxide ratio of 2:1, verified through optical examination, ESCA, Auger, and SEM analyses.
Able Electropolishing achieves Ra values as low as 4 µin on semiconductor components. Typical improvement is from 8–16 µin before electropolishing to 4–8 µin after — well within SEMI F19 requirements for wetted surfaces in chemical distribution systems.
Electropolishing is 30 times more effective than passivation alone for improving corrosion resistance. It removes free iron and surface irregularities at the microscopic level, creating a uniform passive oxide layer enriched with chromium that withstands the aggressive acids, solvents, and etchants used in semiconductor manufacturing.
Able Electropolishing processes a wide range of alloys for semiconductor customers, including 316/316L stainless steel, 304/304L, 347, 321, 2205 Duplex, AL-6XN, 254 SMO, aluminum alloys (1100, 6061, 5052, 7075), nickel alloys (Hastelloy C, Inconel 718, Inconel 600/601, Monel 400, Incoloy), and copper alloys (OFHC 101, 260 Brass).
Electropolishing typically removes between .0002" and .001" of material per surface. Because removal is uniform across all surfaces, it can be planned into part design — allowing engineers to specify electropolished final dimensions while maintaining tight tolerances throughout the semiconductor component.
Electropolishing is a precise and controllable process for eliminating defects from the surface of metal parts. But it’s not the only finishing process available to manufacturers; there are mechanical, chemical and plating processes that can remove defects and improve the…
Metal fabrication for parts used in the medical and electronics industries can involve dimensions as small as a grain of rice — or even a strand of hair. At that scale, surface defects may be invisible to the naked eye,…
While stainless steel is known for its corrosion resistance, it contains iron, which is susceptible to corrosion, especially if parts are frequently exposed to moisture or harsh environments. Contamination left behind by machining processes can also impede the corrosion resistance…
Electropolishing’s ability to remove a microscopically precise layer of surface material – with consistent and repeatable results – is a key reason it is so often specified as the final step in finishing metal parts for industries with no room for error.
